Cubic silicon carbide ceramic powder is a gray-green powder. Its chemical molecular formula is: SiC, molecular weight 40.10, density 3.2g/cm3, melting point 2973℃, thermal expansion coefficient 2.98×10-6K- 1.
Silicon carbide ceramic powder has high purity, narrow particle size distribution, small pores, high sintering activity, regular crystal structure, excellent thermal conductivity, and is a semiconductor that can resist oxidation at high temperatures; β-SiC whiskers are long Large diameter ratio, high surface finish, high diameter ratio, and low particle content in the whiskers, its performance is better than others whether it is immersed in a corrosive environment, extremely abrasive industrial and mining, or exposed to temperatures exceeding 1400°C. Commercially available ceramic or metal alloys, including ultrahigh temperature alloys.
Specifications of Silicon Carbide:
Product Type |
Silicon Carbide(β-SiC Grit) |
Silicon Carbide (β-SiC Powder) |
Silicon Carbide(α-SiC Powder) |
|
Phase content |
≥99% |
β≥99% |
≥99% |
|
chemical composition (wt%) |
C |
>30 |
>30 |
- |
S |
<0.12 |
<0.12 |
- |
|
P |
<0.005 |
<0.005 |
- |
|
Fe2O3 |
<0.01 |
<0.01 |
- |
|
Grain(μm) |
Customization |
|||
Brand |
Xinli Abrasive |
Main uses of silicon carbide: Xinli Abrasive can provide silicon carbide for a variety of uses, including hexagonal or rhombohedral α-SiC and cubic β-SiC and β-SiC whiskers. Composite materials composed of silicon carbide and plastics, metals, and ceramics can significantly improve its various properties. Due to its high thermal stability, high strength, and high thermal conductivity, it is widely used in atomic energy materials, chemical devices, high temperature processing, and electrical and electronic materials. , semiconductor field, electric heating components and resistors, etc. It can also be used in abrasives, abrasive tools, advanced refractory materials, and fine ceramics.
cubic silicon carbide offers a range of applications across multiple industries, particularly in high-power electronics, RF devices, power electronics, semiconductor substrates, high-temperature environments, sensors, and optoelectronics.
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